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SKU: 637739663955412271
Rs.450
Rs. 563
Phone BGA Removing / Soldering, Motherboard BGA dissembling and assembling
Material: plastic & stainless steel
Features:
The knife blades are made of stainless steel
Multiple Ultra-thin blades, capricious good, it can ease between the chip and the phone circuit board at the end, is not easy to lead off point.
